iPad 3 Back panel leaked!

The upcoming iPad 3 has received extreme anticipation due to the rumours surrounding the iPad 3′s retina screen. This was rumoured before the iPad 2 launch as well but its much more likely to happen this time, with Android Tablet manufacturers sporting their Full HD+ screens as CES 2012. Furthermore the casing is purported to be around 1mm thicker due to an increased battery size, to deal with the larger display, and new chipsets being placed inside the iPad 3.

The new chipset was originally purported to be a A9 quad core processor, akin to the Tegra 3, however sources tell us that it is more likely going to be the new A15 dual-core which is much more power efficient, offering greater performance with battery life. A new logic board is definitely confirmed from this image, as different mounts have been added, showing that an Apple A6 processor is all but confirmed.

Also shown on the image is that the camera is different, most likely improved, with a higher mega pixel count, along with a front Facetime HD camera, much like the iPhone 4S.

The rumoured announcement date, is around February 29th, but it could change yet. Putting the release date a few weeks later.

Source: RepairLabs